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Heat Sink Package Tungsten Copper Alloy Polished Grinding

Name: Heat Sink Package Tungsten Copper Alloy Polished Grinding
Brand: JINXING
Price: 1 USD

China Heat Sink Package Tungsten Copper Alloy Polished Grinding wholesale

Brand Name : JINXING

Model Number : Copper Tungsten / WCu alloy

Certification : ISO 9001

Place of Origin : China

MOQ : 5KGS

Payment Terms : L/C, D/A, D/P, T/T, Western Union

Supply Ability : 10000kgs/M

Delivery Time : 10~25 work days

Packaging Details : Plywood Case

Material : Tungsten Copper

Surface : Polished and Grinding

Content : W75, W85, W80, W55, W65, W90

Dimensions : Customized

Density : 12.2~17g/cm3

Application : Resistance Welding , Spot Welding

Type : RWMA Class 10,Class 11, Class 12

Grade : 1W3, 3W3 , 5W3, 10W3 , 30W3 ,3W53,10W53

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Tungsten Copper Heat Sink Package Sheet,Tungsten Copper Shim,Tungsten Copper Sheet

Product Introduction:

W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience

Tungsten Copper Heat Sink Package Sheet Advantages

· High thermal conductivity

· Excellent hermeticity

· Excellent flatness, surface finish, and size control

· Semi-finished or finished (Ni/Au plated) products available

Tungsten Copper Heat Sink Package Sheet are used to conduct heat away from computer chips and integrated circuits, preventing thermal damage. Depending on the electronic device, heat sinks come in different sizes and shapes. Tungsten-copper composites, with copper content (by weight) of 15 to 20 percent, are often used to make heat sinks. Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.

hysical Properties of Major Products

Mark	Wt%(W)	Wt%(Cu)	Density at 20ºC	Thermal conductivity at 25ºC	Coefficient of thermal expansion at 20ºC
W90Cu10	90±1	rest	17.0g/cm³	180-190	6.5
W85Cu15	85±1	rest	16.4g/cm³	190-200	7.0
W80Cu20	80±1	rest	15.6g/cm³	200-210	8.3
W75Cu25	75±1	rest	14.9g/cm³	220-230	9.0
W50Cu50	50±1	rest	12.2g/cm³	310-340	12.5

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Heat Sink Package Tungsten Copper Alloy Polished Grinding

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