Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity

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JINXING MATECH CO LTD

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Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity

Name: Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity
Brand: JINXING
Price: 30 USD

China Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity wholesale

Brand Name : JINXING

Model Number : Molybdenum Copper Wafer substrate

Certification : ISO 9001

Place of Origin : China

MOQ : 1kg

Price : 30~150USD/kg

Payment Terms : L/C, D/A, D/P, T/T, Western Union

Delivery Time : 25 work days

Packaging Details : Plywood Case

Supply Ability : 1000kgs/M

Material : Molybdenum Copper Alloy

Standard : ASTM, AMS

Surface : Mirror bright

Size : Customized

Min THK : 0.05mm

Type : MoCu15~MoCu50

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Molybdenum Copper Wafer substrate for LED chips Diameter 25.4mm / 1.0 inch

Wafer substrate made of molybdenum, molybdenum copper and tungsten copper materials: In order to make the LED lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer substrates, LED chips can easily reach 100,000 hours of service life.

Description

Nickel-plated gold-plated molybdenum-copper substrate microelectronic electronic sealing sheet

Copper-molybdenum-copper alloy heat sink material is a composite material of tungsten and copper. It has both low expansion characteristics of tungsten and high thermal conductivity of copper. Especially valuable, its thermal expansion coefficient and thermal conductivity can be adjusted by adjusting the material. The composition of the composition (in terms of terms, its performance is tailorable), thus bringing great convenience to the application of the material. The copper-molybdenum-copper alloy heat sink material produced by our company can form a good thermal expansion match with the following materials:

Ceramic materials	Al2O3 (A-90, A-95, A-99), BeO (B-95, B-99), AlN, etc.
Semiconductor materials	Si, GaAs, SiGe, SiC, InGaP, InGaAs, InAlGaAs, AlGaInP, and AlGaAs
Metal materials	Kovar alloy (4J29), 42 alloy, etc

The characteristics and performance of our company's copper-molybdenum-copper (Cu/Mo/Cu) alloy heat sink material:

Copper-molybdenum-copper (Cu/Mo/Cu) is a sandwich structure consisting of two sub-layers - copper (Cu) - a core layer - molybdenum (Mo), which has an adjustable coefficient of thermal expansion, high thermal conductivity and its high The characteristics of strength.

1. Copper-molybdenum-copper (Cu/Mo/Cu) alloy heat sink material Features:

High thermal conductivity can be maintained without adding sintering and activation elements such as Fe and Co

Can provide semi-finished products or finished products with Ni/Au plating on the surface

Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity

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